Pii: S1359-6454(98)00428-5

نویسندگان

  • J. XU
  • G. S. COLLINS
  • L. S. J. PENG
چکیده

ÐAn unstable, f.c.c. Fe50Cu50 solid solution was prepared using high-energy ball milling of an elemental powder mixture. It was used as a parent alloy for isothermal annealing or low-energy ball milling (LEBM), both at 373±523 K. Alloy evolution was analyzed by X-ray di€raction, MoÈ ssbauer spectroscopy and di€erential scanning calorimetry. LEBM signi®cantly enhanced the initial decomposition rate, but the decomposition process was complex and not monotonic. At and below 423 K, the initial decomposition was completely reversed at later times. The results are interpreted in terms of an e€ective-temperature model proposed by Martin for irradiated alloys. A dynamic phase diagram in the e€ective temperature is presented, and used to explain the presence of a two-phase region under all milling conditions. The nonmonotonic behavior is suggested to be a result of coupling between phase evolution and mechanical properties, leading to a time dependence of the e€ective temperature. # 1999 Acta Metallurgica Inc. Published by Elsevier Science Ltd. All rights reserved.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Pii: S1359-6454(99)00264-5

ÐThe grain boundary segregation of Bi in dilute polycrystalline Cu±Bi alloys was systematically studied as a function of temperature and composition. The temperature dependencies of the Gibbsian excess of Bi at the grain boundaries exhibited discontinuous changes at the temperatures close to, but di€erent from the bulk solidus temperatures. The observed segregational phase transition was interp...

متن کامل

Pii: S1359-6454(96)00395-3

Debonding of films attached to substrates as well as fibers embedded in matrices typically involves initiation, steady-state propagation and a final transient as the debond converges on an edge or another debond. The emphasis in this paper is on the mechanics of the transient. Under most circumstances, a converging debond crack is characterized by an energy release rate that approaches zero, ca...

متن کامل

Pii: S1359-6454(98)00345-0

ÐIn current design the circuitry is extended very close to the edges of a silicon die to maximize useful surface area. When the die is bonded to a polymer substrate, with the circuitry facing the polymer, thermal mis®t stress concentrates at the die edges and may damage the circuitry. The stress distribution near a die edge is quanti®ed using a combination of asymptotic analysis and ®nite eleme...

متن کامل

Pii: S1359-6454(99)00156-1

ÐThe e€ect of hydrogen in solid solution on the edge/screw character of dislocations has been investigated by deforming samples of high-purity aluminum in a gaseous hydrogen environment in situ in a controlled environment transmission electron microscope. Solute hydrogen was found to stabilize edge segments of dislocations, which inhibited, and in some cases stopped dislocations from cross-slip...

متن کامل

Pii: S1359-6454(99)00023-3

ÐThe durability of residually compressed coatings, particularly thermal barrier coatings (TBCs), is governed by events occurring at the interface with the substrate. In general, failure involves the sequential nucleation growth and coalescence of separations in the presence of imperfections and defects. The growth and coalescence phases are analyzed. Remnant ligaments are expected from the mech...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 1998